You could almost get away with it if you had a high temperature tolerant support structure.
For example, if you have a dual head system, where one head extruded sand and the other extruded tin or solder.
A layer would be a surrounding 1-2mm high sand area, then the tin extruder would fill in the void.
Complications involve the embedded of sand in the surface of tin, inter-layer adhesion, and calculating the slope angle of the sand as you get to higher layers.