Most of electronic boards apply potting compounds to protect the board. However, I've found there're several problems by applying potting compounds.
The shell of compounds is larger than expected. There's only limited space in the factory, but it needs more space to solidify the shell. It takes 24 hours to solidify the compounds.
Summarized the matters mentioning above as follows:
1. The size is larger after potting compound
2. Solidify time 24 hours
3. Not suitable for mass production
Is there any better way to prevent the problems?
thank you!!
