Producing the Gen7 board January 28, 2013 04:49AM |
Registered: 11 years ago Posts: 62 |
Re: Producing the Gen7 board January 28, 2013 07:23AM |
Registered: 13 years ago Posts: 7,616 |
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Unfortunately I don't use gEDA but eagle and don't have a Linux installed.
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In the release documents I can find two layouts, one called solder and one called components. I guess these are other names for top and bottom layer?
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If this is a single layer layout, why are there traces on the components layer? Am I supposed to connect them with wire bridges?
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And last, if I comply the step by step tutorial on the wiki page, will something different result than the layout in the release documents? Or is this already after this edit?
Generation 7 Electronics | Teacup Firmware | RepRap DIY |
Re: Producing the Gen7 board January 28, 2013 08:43AM |
Registered: 11 years ago Posts: 62 |
Re: Producing the Gen7 board January 28, 2013 02:29PM |
Registered: 13 years ago Posts: 7,616 |
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I see. But for version 1.5 there are several other bridges to solder?
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I meant if I follow the instructions on how to make the board files "etchable" (http://reprap.org/wiki/Generation_7_Electronics#Etching), will I get a different result as the one already in the release documents?
Generation 7 Electronics | Teacup Firmware | RepRap DIY |