Re: Full Color 3d Printer Project - hot end design May 21, 2013 06:31PM |
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Re: Full Color 3d Printer Project - hot end design May 22, 2013 03:01PM |
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Re: Full Color 3d Printer Project May 22, 2013 03:41PM |
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Re: Full Color 3d Printer Project August 30, 2013 01:00AM |
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Re: Full Color 3d Printer Project August 30, 2013 11:33AM |
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Re: Full Color 3d Printer Project September 30, 2013 07:37PM |
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Re: Full Color 3d Printer Project October 07, 2013 08:51PM |
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Re: Full Color 3d Printer Project October 26, 2013 06:27PM |
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Re: Full Color 3d Printer Project November 05, 2013 01:46AM |
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Re: Full Color 3d Printer Project November 24, 2013 11:52AM |
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Re: Full Color 3d Printer Project November 28, 2013 12:46AM |
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paucus
Someone did some experiments with coloring the white filament with whiteboard markers, and it seemed promising. Mark the filament before you heat it, but the software needs to estimate accurately how much filament it is using, so it can color it ahead of the time it will need it... what do you think?
Or what about injecting dye? of course you have to heat it so it won't steam and make bubbles...
Re: Full Color 3d Printer Project November 28, 2013 07:29AM |
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Re: Full Color 3d Printer Project December 02, 2013 05:50PM |
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Re: Full Color 3d Printer Project December 28, 2013 11:26AM |
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Re: Full Color 3d Printer Project December 28, 2013 04:57PM |
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Re: Full Color 3d Printer Project - hot end design December 28, 2013 05:07PM |
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Quote
crispy1
Anyone up for filing disputes on this patent application, since we discussed this method extensively in this forum?
Quote
20130342592
What is claimed is:
1. An assembly configured for adjusting a position of a three-dimensional object in an inkjet printer, the assembly comprising: a fixture configured to hold a circuit board such that first and second nonparallel surfaces of the circuit board are exposed; a tilt adjustment mechanism coupled to the fixture and configured to adjust a tilt angle of the circuit board; and a rotational adjustment mechanism coupled to the fixture and configured to adjust an angular position of the circuit board, wherein the tilt adjustment mechanism and the rotational adjustment mechanism are configured to upwardly orient the first and second nonparallel surfaces of the circuit board.
2. The assembly of claim 1, further comprising a vertical adjustment mechanism coupled to the fixture and configured to adjust a vertical position of the circuit board.
3. The assembly of claim 1, wherein the tilt adjustment mechanism is configured to tilt the first and second nonparallel surfaces of the circuit board to the tilt angle at least about 45 degrees from vertical.
4. The assembly of claim 1, wherein the rotational adjustment mechanism comprises a rotatable shaft.
5. The assembly of claim 4, wherein the tilt adjustment mechanism comprises a hinge coupled to the rotatable shaft.
6. An inkjet printer configured for printing on a three-dimensional object, comprising: a print head configured to eject an ink; and an assembly configured for adjusting a position of a circuit board relative to the print head, the assembly comprising: a fixture configured to hold the circuit board such that first and second nonparallel surfaces of the circuit board are exposed; a tilt adjustment mechanism coupled to the fixture and configured to adjust a tilt angle of the circuit board; and a rotational adjustment mechanism coupled to the fixture and configured to adjust an angular position of the circuit board, wherein the tilt adjustment mechanism and the rotational adjustment mechanism are configured to upwardly orient the first and second nonparallel surfaces of the circuit board.
7. The inkjet printer of claim 6, further comprising a vertical adjustment mechanism configured to adjust a separation distance between the print head and the circuit board.
8. The inkjet printer of claim 7, wherein the vertical adjustment mechanism is configured to adjust a vertical position of the circuit board.
9. The inkjet printer of claim 7, wherein the vertical adjustment mechanism is configured to adjust a vertical position of the print head.
10. The inkjet printer of claim 6, further comprising a horizontal adjustment mechanism configured to adjust a horizontal position of the print head.
11. The inkjet printer of claim 10, wherein the horizontal adjustment mechanism is configured to adjust the horizontal position of the print head along first and second axes.
12. The inkjet printer of claim 6, wherein the tilt adjustment mechanism is configured to tilt the first and second nonparallel surfaces of the circuit board to the tilt angle of at least about 45 degrees from vertical.
13. The inkjet printer of claim 6, further comprising a pretreatment apparatus configured to direct a pretreatment onto the circuit board.
14. The inkjet printer of claim 13, wherein the pretreatment apparatus is coupled to the print head.
15. The inkjet printer of claim 6, further comprising a curing apparatus configured to cure the ink.
16. The inkjet printer of claim 15, wherein the curing apparatus is coupled to the print head.
17. The inkjet printer of claim 6, further comprising an insulation remover.
18. A method for inkjet printing on a three-dimensional object, comprising: positioning a circuit board proximate a print head such that a first surface and a second surface that are nonparallel are exposed and the first surface is upwardly oriented; ejecting a conductive ink onto the first surface of the circuit board; adjusting a position of the circuit board such that the second surface is upwardly oriented; and ejecting the conductive ink onto the second surface of the circuit board.
19. The method of claim 18, wherein adjusting the position of the circuit board comprises adjusting a tilt angle of the circuit board.
20. The method of claim 18, wherein adjusting the position of the circuit board comprises adjusting an angular position of the circuit board.
21. The method of claim 18, further comprising directing a pretreatment onto the first surface prior to ejecting the conductive ink onto the first surface; and directing the pretreatment onto the second surface prior to ejecting the conductive ink onto the second surface.
22. The method of claim 18, further comprising curing the conductive ink.
Re: Full Color 3d Printer Project December 28, 2013 05:27PM |
Admin Registered: 14 years ago Posts: 730 |
Re: Full Color 3d Printer Project - hot end design December 28, 2013 05:46PM |
Registered: 12 years ago Posts: 325 |
Re: Full Color 3d Printer Project December 28, 2013 06:47PM |
Admin Registered: 14 years ago Posts: 730 |
Quote
paucus
This seems to be using an inkjet to color an FDM type printer
Re: Full Color 3d Printer Project April 21, 2014 06:42PM |
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Re: Full Color 3d Printer Project May 20, 2014 08:54AM |
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Quote
Software to use G-code values for different values of amount of each filament to use
Re: Full Color 3d Printer Project May 21, 2014 11:34PM |
Registered: 12 years ago Posts: 364 |