RD3D/1.0

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Revision as of 21:46, 15 September 2017 by Lkcl (talk | contribs) (PCB Design features)
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RD3D 1.0

Release status: in development

RD3D 1.0 render.jpg
Description
RepRap Due 3D Printing shield Arduino DUE based modular RepRap electronics.
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CAD Models
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RD3D v1.0 - Reprap Duet for 3D Printing

This board is derived from Ramps 1.4.2 and has the following features and improvements:

  • Suitable for use with Arduino Due: uses 3.3v supply from Due, not 5.0v
  • Suitable for up to 24v on both or either Power inputs
  • Removed all double Stepper connectors (motors should be wired in series)
  • Removed all AUX except I2C, AUX4 (for LCD) and AUX3 (for SPI-Ethernet)
  • Removed MAX Endstops
  • Removed Thermal Pads to increase power handling capacity between layers
  • Added MicroSD Card (for porting RepRapFirmware)
  • Moved D8, D9 and D10 LEDs next to their outputs
  • Increased current capacity of 3V3 trace to MicroSD, AUX3 and AUX4
  • Increased Main Power copper pour (inc. to VMOT) widths, added extra VIAs
  • Moved Thermistor jumpers down to end of PCB, linked to closer ADC pins
  • Added UA78M08DCY 500mA 8V Power Regulator, to supply Arduino from up to 24v)
  • Added extra 6th Stepper Board. Can now do auto-bed levelling (triple Z)
  • Added Twin Header for 2 always-on fans (connected directly to Power In)
  • Added a SN74HC125 to the MOSFETs to achieve full RDSon (Due is 3.3v)
  • Added D11 GPIO (with a pulldown) to disable MOSFETs on Due startup
  • Added GND Shielding VIAs
  • Significantly adjusted pinouts so that wires do not cross (reduce EMC)
  • Simplified Copper pour: single GND on TOP and BOTTOM with low priority
  • Fully GPLv3 compliant (full CAD source always available)

Being based on RAMPS 1.4.2 it also has the following features:

  • Improved current-carrying capacity (1oz copper instead of 0.5oz)
  • Standard removable Blade fuses
  • Suppresion capacitors on endstops
  • Extra jumper on the reset switch

PCB Design features

Here are some of the design features:

  • LEDs next to each power output, Heater, Fans, Extruder
  • Improved copper pour for VMOT power
  • MicroSD card added; Thermistor terminals moved right next to ADC
  • Tri-state Buffer on MOSFETs (3.3v to 5v conversion for Due); D11 disables MOSFETs (defaults to off)
  • LDO with an 8V 500mA output supplies power to Due from input voltage, accepts anywhere between 12v and 24v

GPLv3 PCB Board Source code

Available at http://hands.com/~lkcl/rd3d

git clone http://hands.com/~lkcl/rd3d/.git

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