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SinapTec AT328.01 is a 3D FDM printer controller board of very low cost, its operation is based on an Arduino Nano running a version of Teacup_Firmware. The board layout is designed so that it can be manufactured by any hobbyist, it is a simple face plate with through-hole components.
- 1 Arduino Nano socket.
- 4 Pololus sockets (X,Y,Z y E)
- 3 Line in for X_MIN, Y_MIN and Z_MIN endstops.
- 2 Line in for Hotend and heated bed sensors.
- 3 Mosfets outputs for Heater, Fan and Bed (this last with independent power supply).
First tests SinapTec 3D controller board Printer: https://www.youtube.com/watch?v=ce9a7WTrSbA
First Impression With Controller SinapTec: https://www.youtube.com/watch?v=Eok0S3jyTSo
Bill of Materials (BOM)
Drivers Characteristics and Configuration
The following table compares the DRV8825 vs A4988 driver that can be used on this board.
|Availability||very widely available||widely available|
|Approx. price||$6.80 / 5 pieces||$10 / 5 pieces|
|Max. theoretical current||2A||2.5A|
|PCB color||Green / Red||Purple|
|Stepper current adjust. trimpot||Yes, near Dir pin||Yes, near En pin|
|Typical Rs value|| 0.05 Ohm or
0.1 Ohm or
|Vref formula (*)||I_TripMax= Vref/(8*Rs)||I_TripMax= Vref/(5*Rs)|
|Thermal Overload Protection (**)||Yes||Yes|
|Small heatsink included (***)||Almost always||Sometimes not|
|Active cooling required?||Recommended||Recommended|
|IC packaging||5x5mm 28-lead QFN||9.7x6.4mm 28HTSSOP|
Note that some important technical characteristics from the respective datasheets of the ICs are not directly comparable. For example, the DRV8825 is fully specified in terms of thermal characteristics, the A4988 is not. Another important characteristic that unfortunately is not directly comparable is RDSon, which is specified at different current levels in the respective IC datasheets.
(*) Adjusting the stepper driver current
See these instructions: Pololu_stepper_driver_board#Tuning_motor_current.
(**) Temperature Overload Protection
It is very important to keep the stepper driver ICs below a certain temperature during printing, since both ICs feature thermal overload protection that when triggered (typically when the die reaches a temperature of around 150~160 C), shuts down the output stages i.e. halts all commands to the affected stepper and in doing so, ruins the part being printed.
It is not yet determined how much of a real impact the small aluminum heatsinks have on cooling the ICs, as both stepper driver ICs depend much more on proper PCB layout and solder pad contact (as well as proper airflow, remember!) for heat dissipation, rather than on dissipation through the top of the IC package. This is because both stepper driver ICs have an exposed metal pad under the chip that contacts the PCB and this is the "path of least resistance" for heat dissipation. The secondary path for heat dissipation is through the package leads and in this aspect the DRV8825 provides for possibly slightly better power dissipation compared to the leadless A4988. It is my understanding that dissipation through the top of the ICs is almost irrelevant here.
|Jumper 1||Jumper 2||Jumper 3|| Microstep
|Jumper 1||Jumper 2||Jumper 3|| Microstep
|No||No||No||Full Step||No||No||No||Full Step|
|Yes||No||No||Half Step||Yes||No||No||Half Step|
|No||Yes||No||1/4 Step||No||Yes||No||1/4 Step|
|Yes||Yes||No||1/8 Step||Yes||Yes||No||1/8 Step|
|Yes||Yes||Yes||1/16 Step||No||No||Yes||1/16 Step|
Notes: *Jumpers need to be installed under each stepper driver. *1/16 Microstep Resolution is the default thats being used.
A best practice is a technique or methodology that, through experience and research, has proven to reliably lead to a desired result.
- To avoid overheating or the use of heatsink is recommended to change the hotbed's mosfet for one of better quality, such as a IRBL3034, IRBL8743, or similar.
- It higly recommended to place a fuse on power input of 5A and 10A for the bed.
|ATO / ATC Fuse||Cartridge Fuse|
- Active cooling over the electronics with a 80mm cooler is recommended.
|12v 80mm Cooler|