FYI
[
code.arc.cmu.edu]
GOLD LEAF FOIL
We developed a method for “printing” circuits on paper.
This allows the paper devices provided a method of
production that could be mass customized, rendering
the design and interaction behavior of the paper
devices open to a co-design process. The circuit shown
in figure 4 was made by applying a spray-on adhesive
through a laser cut stencil. Gold leaf was then applied
to the resulting glue traces and brushed away in a
process similar to gold leaf gilding. Components were
then glued to the circuit using conductive glue, brass
clips connect the circuit with external components such
as the power supply and muscles. (A method of printing
glue directly onto the paper would enable unique
circuits to be produced quickly.)
